Polishing Plate Redesign
Conceptual project to introduce modular thinking into manufacturing consumer polishing plates. Large variation in product range, resulting in higher production costs for bespoke designs. These plates are used to shape and smooth the surface of electronic wafer materials and geological samples to precise tolerances.
Key focus was to establish features that could be combined in jig tooling and interchangable components to reduce part variation in product range
CONCEPT DESIGN
Gained greater understanding of customer requirement from processing dept. to produce range of ideas and set-up testing for various approaches to redesigning polishing plate range
CAD DESIGN
Narrowed down to two iterations that would reduce total of manufacturing jigs used and make track width required for wafer processing modular
RESULT
Scheduled range of testing to ensure proposals maintained required polishing output and gained further feedback from lab users which modular design would be preferred
